Shandong Zhancheng Intelligent Manufacturing Co., Ltd
Total Solution for Laser Equipment
Professional Manufacturer Laser Equipment
Glass Processing Revolution: Glass Drilling | Glass Cutting (Cracking) | Dual-Station Cutting and Cracking (Pre-Cut, Post-Crack)
Release time:
2025-12-02
Author:
Source:
I. Core Functions and Technical Specifications
1. Glass Cutting
Ultra-Precision Micro-Machining
Supports cutting of ultra-thin glass (0.1mm) including soda-lime glass and Corning Gorilla Glass, with positioning accuracy of ±0.01mm (ISO 2768 standard), achieving hair-diameter level processing capability (~50μm).
Complex Geometric Path Planning
Adaptive cutting path generation based on topological algorithms, supporting arbitrary polygons, hollow structures, and free-form surface cutting (maximum curvature radius R=0.1mm).
2. Glass Drilling
Micro-hole Precision Machining
Minimum aperture 0.05mm (Φ0.05@30mm thickness), edge roughness Ra≤0.1μm (SEM inspection), chipping <10μm (compliant with MIL-STD-883K).
Deep-to-Diameter Ratio Capability
Supports micro-hole array processing with a depth-to-diameter ratio of 1:10 (maximum depth 3mm), suitable for MEMS sensors and CMOS image sensor packaging.
3. Intelligent Cracking Process
Cold Processing with No Thermal Damage
Utilizes picosecond UV laser (355nm wavelength) combined with stress-induced cracking technology, achieving heat-affected zone (HAZ) <20μm and ≥50% yield improvement.
Fully Automated Batch Processing
Supports G-code instruction set batch execution with <50ms inter-device response time, achieving cracking efficiency of 1200pcs/h (based on 600×900mm substrate testing).
II. Industry Solutions
1. Consumer Electronics
OLED Curved Screen Cutting
Suitable for cutting 2.5D/3D curved glass in smartphones/tablets, with edge strength retention rate >92% (three-point bending test).
Camera Module Micro-hole Processing
Supports processing φ0.03mm micro-hole arrays for periscope lens modules (depth tolerance ±1μm).
2. New Energy Sector
Lithium Battery Glass Encapsulation Cracking
Adapted for CTP battery cover glass slotting (depth 1.2mm±0.05mm), processing speed 400mm/s.
Photovoltaic Glass Hole Drilling
Supports batch processing of Φ2mm drainage holes for double-glass modules (hole wall perpendicularity <0.02mm).
3. Semiconductor/Optics
Precision optical lens machining
Suitable for cutting hard and brittle materials like calcium fluoride (CaF₂) and sapphire, achieving surface roughness Ra ≤ 10nm (AFM-verified).
LiDAR glass component processing
Supports MEMS micro-mirror glass substrate cutting (dimensional tolerance ±5μm).
Key words:
laserengraving,lasercutting,glassart,customglass,laser,Glass Cutting Machine,Laser Glass Cutting Machine
Floor 16, Building A, Rongsheng Times International, Licheng District, Jinan City, Shandong Province，China