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The difference between laser etching machine, laser marking machine and laser engraving machine
Release time:
2025-09-26
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Differences between Laser Etching and Laser Marking
Laser marking is the process of creating a mark on a material's surface. While it may sound similar to laser etching, there are significant differences between the two. In laser marking, the material does not melt or vaporize. Instead, the laser heats the surface, causing the material to stain due to oxidation. In contrast, laser etching involves melting and/or vaporizing the top layer of the material to create voids or micro‑protrusions, thereby highlighting the desired shape or pattern.
Differences between Laser Etching and Laser Engraving
Laser etching is faster, but laser engraving is more durable. This is because the energy required to reach the material's melting point (laser etching) is less than the energy required to vaporize the material (laser engraving). Deep laser engraving may even require multiple laser passes, which inevitably takes longer.
Different Cutting Depths:
One significant difference is cutting depth, which plays a significant role in the mark's visibility and wear resistance. Cutting depth depends on the material's hardness and the laser marking power rating. However, laser etching melts the surface, resulting in minimal cutting.
Different Outputs:
Engraving is the most cost‑effective option in some industries, while laser etching, due to its greater versatility, offers a cost‑effective option with higher production volumes.
Durability Difference:
Compared to engraving, laser etching offers less wear resistance. Generally, etched markings have a lifespan of approximately 5 to 10 years, making them unsuitable for heavy‑duty products or those exposed to harsh conditions. Laser engraving, however, offers exceptional durability due to its deeper indentations and resistance to wear.
Cost Difference:
For the same design, material, and production volume, laser engraving costs more than laser etching because it requires more time and high‑powered laser technology.
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